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Snap Cure Conductive Adhesive

22 Sep 2015
Engineered Materials Systems, introduced its new EMS 561-403 Low-Cost Snap Cure Conduc-tive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.
The adhesive is stress absorbing to withstand the rigors of thermal cycling and features conduc-tive stability to cell and ribbon metallization during damp heat exposure. Additionally, the con-ductive adhesive is designed to cure in seconds at 180°C (356°F) or above to enable fast fixtur-ing of the cells in the stringer.
Engineered Material Systems |

Volume: September/October 2015