Encapsulation for semiconductor & solar applications

ProTechna EncapsulationGreene, Tweed is continuing to enable the next generation of semiconductor and solar technology, expanding their ProTechna encapsulation capability to provide the ultimate level of protection in critical applications. ProTechna safeguards sensitive components, eliminating direct exposure to damaging conditions such as temperature, plasma, chemical, and abrasion. This enhanced protection minimizes harmful particulation, extends operational service life, and maximizes production capabilities.

As part of the company’s portfolio of OpTegra integrated solutions, Greene, Tweed’s ProTechna capability offers custom solutions that solve critical environmental challenges to maximize production. Their engineers evaluate each customer application, providing technical expertise to select the material and design a solution with the ultimate level of protection and performance for critical components. From process doors to chamber lids and gates, ProTechna shields components from aggressive chemical and thermal attack in semiconductor and solar production. ProTechna also enables multiple components to be integrated into a single-part solution. This part count reduction simplifies installation, as well as reduces inventory and maintenance costs.

Greene, Tweed

Volume: Sep/Oct 2010