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DuPont Pyralux AP to Aid Reliable Performance of Semikron-Danfoss eMPack Modules Powering Next-Gen Electric Vehicles

22 Sep 2022

DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont Pyralux AP all-polyimide double-sided copper clad laminate into its eMPack power modules to further enhance the capabilities of next-gen electric vehicles.

Integrating Pyralux AP copper clad laminate into eMPack traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. The characteristics of Pyralux AP benefiting this application from Semikron-Danfoss include:

    •    Robust thermal resistance for temperature stability

    •    All-polyimide dielectric layer

    •    Extreme durability

    •    Excellent bond strength for automotive-grade reliability

    •    Excellent low dissipation loss characteristics

    •    Superior electrical performance

    •    Consistent signal integrity

Further, Pyralux AP's dielectric thickness tolerance and low coefficient of thermal expansion make it ideal for rigid flex or multiple layer flex applications. The adhesive-less flexible circuit material has a flammability rating of UL 94-V0, a maximum operating temperature of 200°C, and is certified to IPC 4204A/11.

"Pyralux AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe," said Karl-Heinz Gaubatz, CTO of Semikron. "eMPack is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux technology to help eMPack become a global leader in EV power modules."

Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack power modules to a major German automotive manufacturer.  Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD).

"We are excited how this EV power module application of Pyralux AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come," said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. "The eMPack power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack and appreciate the collaboration with Semikron-Danfoss."

DuPont |

Semikron Danfoss |