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Low-cost snap cure conductive adhesive

14 Nov 2016

Engineered Materials Systems introduces its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact. The adhesive is stress-absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to cure in seconds at 150 °C to 180 °C to enable fast fixturing of the cells in the stringer. EMS 561-676 offers a more than 50% cost savings compared to standard silver-filled conductive adhesives.

Engineered Material Systems | 

Volume: 2016 November/December