Thermal interface material

AI Technology, Inc. (AIT) introduces COOL-PAD CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase. COOL-PAD CPR7154 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor wind turbine electronic module thermal management applications, including: inverters; converters; gearboxes; generators; transformers; pitch controls; nacelle (air conditioning); and general control cabinets.

Filled with a modified oxide mixture, COOL-PAD CPR7154 is electrically insulating at normal voltage. It’s optimized to accommodate large areas with different heights and gaps, and is engineered to have high compressibility as applied in comparison to traditional thermal pads. Once a device temperature reaches 45° C (113° F), COOL-PAD will “melt-flow” to fill even the smallest of trapped air along the interface between the device and the heat-sink or heat-spreader. COOL-PAD CPR7154 is semi-tacky on both sides for optimum thermal transfer performance. It offers high-thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing.

AI Technology, Inc. (AIT)

www.aitechnology.com/analysis


Volume: May/June 2014